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| september 2007 rev 2.0 1/28 1 ST7GEME4 full-speed usb mcu with smartcard firmware and emv/non-emv interface features clock, reset and supply management ? low voltage reset ? halt power saving mode ? pll for generating 48 mhz usb clock using a 4 mhz crystal usb (universal serial bus) interface ? usb 2.0 compliant ? ccid v1.0 ? full speed, hubless ? bus-powered, low consumption serial rs232 interface ? transmission rate: 9.6 kbps to 115 kbps ? format: 8-bit, no parity ? auto baud rate ? ccid v1.0 on serial ttl link iso 7816-3 uart interface ? 4 mhz clock generation ? synchronous/asynchronous protocols (t=0, t=1) ? automatic retry on parity error ? programmable baud rate from 372 to 11.625 clock pulses (d=32/f=372) ? card insertion/removal detection smartcard power supply ? selectable card v cc : 1.8 v, 3 v, and 5 v ? internal step-up converter for 5v supplied smartcards (with a current of up to 55ma) using only two external components. ? programmable smartcard internal voltage regulator (1.8 to 3.0 v) with current overload protection and 4 kv esd protection (human body model) for all smartcard interface i/os development tools ? application note on pcb recommendations and component bill of materials ? full hardware/software kit for performance evaluation description the ST7GEME4 is an 8-bit microcontroller dedicated to smartcard reading applications. it has been developed to be the core of smartcard readers communicating through a serial or usb link. it is pre-programmed using gemplus software, and offers a single integrated circuit solution with very few external components. 24 1 vfqfpn24 so24(9u) table 1. device summary features order codes ST7GEME4m1 ST7GEME4u1 program memory 16k rom user ram + usb data buffer (bytes) 512 + 256 peripherals usb full-speed (7 ep), tbu, watchdog timer, iso 7816-3 interface operating supply 4.0 to 5.5 v package so24 vfqfpn24 cpu frequency 4 or 8 mhz operating temperature 0 to +70 c www.st.com
contents ST7GEME4 2/28 contents 1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 ST7GEME4 implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 smartcard interface features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.3 emv versus pc/sc-iso mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 electrical characteristi cs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.2 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.3 supply and reset characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4 clock and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4.1 general timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4.2 crystal resonator oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.5 memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.6 smartcard supply supervisor electrical characteristics . . . . . . . . . . . . . . 19 4.7 emc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.7.1 functional ems (ele ctromagnetic susceptib ility) . . . . . . . . . . . . . . . . . . 21 4.7.2 electromagnetic interference (emi) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.7.3 absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 23 4.8 communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 24 5 package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.1 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 ST7GEME4 list of tables 3/28 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 3. technical features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 4. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 5. thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 6. general operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 7. current injection on i/o port and control pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 8. current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 9. i/o port pins characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 10. led pins characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 11. low voltage detector and supervisor characteristics (lvds) . . . . . . . . . . . . . . . . . . . . . . . 16 table 12. general timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 13. external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 14. crystal resonator osc illator characteri stics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 15. typical crystal resonator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 16. recommended values for 4 mhz crystal resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 17. ram and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 18. smartcard supply supervisor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 19. ems characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 20. emi characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 21. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 22. electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 23. usb dc electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 24. usb full speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 25. 24-lead very thin fine pitch quad flat no-lead 5x5mm,0.65mm pitch, mechanical data. . . . 25 table 26. 24-pin plastic small outline package- 300-mil width, mechanical data . . . . . . . . . . . . . . . . 26 table 27. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 list of figures ST7GEME4 4/28 list of figures figure 1. ST7GEME4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2. 24-lead vfqfpn package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 3. 24-pin so package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. smartcard interface reference application - 24-pin so package . . . . . . . . . . . . . . . . . . . . . 9 figure 5. typical application with an external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 6. typical application with a crystal resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 9 figure 7. usb data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 8. 24-lead very thin fine pitch quad flat no-lead 5x5 mm 0.65 mm pitch, package outline . . . 25 figure 9. 24-pin plastic small outline package- 300-mil width, package outline. . . . . . . . . . . . . . . . . 26 ST7GEME4 introduction 5/28 1 introduction the ST7GEME4 device is a member of the st7 microcontroller family designed for usb applications. all devices are based on a common industry-standard 8-bit core, featuring an enhanced instruction set. the ST7GEME4 is factory-programmed rom devices and as such are not reprogrammable. it operates at a 4 mhz external oscillator frequency. under software control, all devices can be placed in halt mode, reducing power consumption when the application is in idle or stand-by state. the enhanced instruction set and addressing modes of the st7 offer both power and flexibility to software developers, enabling th e design of highly efficient and compact application code. in addition to standard 8-bit data management, all st7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing modes. the ST7GEME4 includes an st7 core, up to 16 kbytes of program memory, up to 512 bytes of user ram and the following on-chip peripherals: usb full speed interface with 7 endpoints, programmable in/out configuration and embedded 3.3 v voltage regulator and transceivers (no external components are needed). iso 7816-3 uart interface with programmable baud rate from 372 clock pulses up to 11.625 clock pulses smartcard supply block able to provide programmable supply voltage and i/o voltage levels to the smartcards low voltage reset ensuring proper power-on or power-off of the device (selectable by option) 8-bit timer (tbu) introduction ST7GEME4 6/28 figure 1. ST7GEME4 block diagram 8-bit core alu address and data bus oscin oscout pa6 4mhz control ram (512 bytes) program (16k bytes) memory 8-bit timer lvd v pp usbdp usbdm usbvcc pa[1:0] supply manager pll oscillator usb port a usb data buffer (256 bytes) divider 8 mhz 3v/1.8v vreg dc/dc crddet crdio crdc4 crdc8 crdrst crdclk iso 7816 uart converter crdvcc self led led0 or 4 mhz 48 mhz diode ST7GEME4 pin description 7/28 2 pin description figure 2. 24-lead vfqfpn package pinout figure 3. 24-pin so package pinout 4 3 5 6 7 8 11 12 13 14 15 16 17 18 19 20 21 22 2 1 23 24 910 c8 crddet crdrst crdclk c4 crdio oscout iccdata/wakup2/ iccclk/wakup2 nc oscin usbv cc dp dm led0 pa 6 vpp gnd gnda diode self vdd vdda crdvcc 14 13 11 12 15 16 17 18 led0 dm dp usbvcc oscin oscout v pp 1 2 3 4 5 6 7 8 9 10 diode crdclk crdrst crdvcc pa 6 crdio 19 20 c8 crddet iccdata/wakup2/ v dda c4 gnda iccclk/wakup2/p nc gnd 21 22 23 24 v dd self pin description ST7GEME4 8/28 legend / abbreviations type: i = input, o = output, s = supply in/output level: ct = cmos 0.3vdd/0.7vdd with input trigger output level: hs = 10ma high sink (on n-buffer only) port and control configuration: ? input: float = floating, wpu = weak pull-up, int = interrupt, ana = analog ? output: od = open drain, pp = push-pull table 2. pin description pin number pin name type level v card supplied port / control main function (after reset) alternate function vfqfpn24 so24 input output input output wpu int od pp 2 5 crdrst o c t x x smartcard reset 3 6 crdclk o c t x x smartcard clock 47c4 o c t x x smartcard c4 5 8 crdio i/o c t x x x smartcard i/o 69c8 o c t x x smartcard c8 7 10 crddet i c t x smartcard detection 811 pa0/wakup2/ iccdata i/o c t xx x xport a0 interrupt, in-circuit communication data input 912 pa1/wakup2/ iccclk i/o c t xx x xport a1 interrupt, in-circuit communication clock input 11 14 oscin c t input/output oscillator pins. these pins connect a 4 mhz parallel-resonant crystal, or an external source to the on-chip oscillator. 12 15 oscout c t 13 16 v pp s must be held low in normal operating mode. 14 17 pa6 i c t pa 6 15 18 led0 o hs x constant current output 16 19 dm i/o c t usb data minus line 17 20 dp i/o c t usb data plus line 18 21 usbvcc o c t 3.3 v output for usb 19 22 v dda s power supply voltage 4-5.5 v 20 23 v dd s power supply voltage 4-5.5 v 21 24 self o c t an external inductance must be connected to these pins for the step up converter 22 1 diode s c t an external diode must be connected to this pin for the step up converter ST7GEME4 pin description 9/28 figure 4. smartcard interface reference application - 24-pin so package 1. mandatory values for the external components: c1 = 4.7 f; c2 = 100 nf. c1 and c2 must be located close to the chip (refer to section 4.4.2 .). c3 = 1 nf; c4 = 4.7 f esr 0.5 ?. c5 : 470 pf; c6 : 100 pf; r : 1.5k ?; l1 : 10 h, 2 ? ; crystal 4.0 mhz; impedance max100 ? d1: bat42 shottky. 23 2 gnda s ground 24 3 gnd s 1 4 cdrvcc o c t x smartcard supply pin table 2. pin description (continued) pin number pin name type level v card supplied port / control main function (after reset) alternate function vfqfpn24 so24 input output input output wpu int od pp led0 dm dp usbvcc oscin oscout v pp diode crdclk crdrst crdvcc pa 6 crdio c8 crddet pa 0 v dda c4 gnda pa 1 nc gnd v dd self v dd c l1 c l2 c4 c5 c6 v dd l1 c3 d1 r led c1 c2 v dd d+ d- ST7GEME4 implementation ST7GEME4 10/28 3 ST7GEME4 implementation the ST7GEME4 has been developed to offer a complete ready-to-use firmware solution which allows fast development and rapid time-to-market of smartcard reader applications. it offers a single ic solution and simplifies the integration of smartcard interfaces into electronic devices such as computers, pos terminals, mobile phones, pdas, home routers, and set-top boxes. pre-programmed with communication software from our partner gemplus, the ST7GEME4 is a complete firm ware solution controllin g the communication between iso 7816 1-2-3-4 cards and a host system. an evaluation kit and reference design with a complete bill of materials and pcb re commendations are available. the ST7GEME4 complies with emvco/emv2000 standards. software support and engineering expertise in system integration and pcb design are available as additional services. 3.1 functionality the core functionality of ST7GEME4 resides in its pre-programmed software embedded in rom memory. gemcore tm technology manages the communication protocol to/from the host computer and the external card. basic features and compliance are described in the features section and in table 3 on page 11 . a dedicated analog block provides smartcard power supplies 1.8 v, 3 v, and 5 v necessary to interface with different card voltages available on the market. voltages are selected by software. external leds can also be directly connected to dedicated i/os. a dedicated uart interface provides an iso 7816 communication port for connection with the smartcard connector. a full-speed usb interf ace port allows external connection to a host computer. an optional rs232 connection is also available on dedicated i/os. 3.2 smartcard interface features the ST7GEME4 firmware includes the following features: compatibility with a synchronous cards compatibility with t=0 and t=1 protocols compatibility with emv and pc/sc modes. compatibility with iso 7816-3 and 4 and ability to supply the cards with 5v, 3v or 1.8v (class a, b or c cards, respectively) resume/wake-up mode upon smartcard insertion/removal further details on smartcard management can be found in "gemcore usb pro reference manual" from gemplus. the reader is able to communicate with smartcards up to the maximum baud rate allowed, namely 344 086 bps (ta1=16) for a clock fr equency of 4 mhz. because the size of the smartcard buffer is 261 bytes, care must be taken not to exceed this size during apdu exchanges when the protocol in use is t=1. ST7GEME4 ST7GEME4 implementation 11/28 3.3 emv versus pc/sc-iso mode the ST7GEME4 supports two operating modes: an emv mode, based on the emv4.1 specifications a pc/sc-iso mode which allows to manage of a smartcard according to the pc/sc and iso 7816-3 standards the default mode is pc/sc, however, the reader can switch between emv and pc/sc-iso modes. gemcore2000 is a utility in ch arge of managing the switch ing between the two modes. when the utility is activated, the reader attempts emv m ode management whenever a smartcard is inserted. if reading is succe ssful, pc/sc mode will not be available. caution: the activation of the gemcore2000 utility must be done before any card command. any activation of the gemcore2000 utility is no t recommended unless the reader is reset. the emv mode fails if: the smartcard has not sent an emv-compliant answer to reset (atr) negotiation of the buffer size with a t=1 card has failed using pc/sc-iso mode with gemcore2000 the reader switches to pc/sc mode after the application or the driver has sent the appropriate dedicated command to the reader (with a proprietary escape command). in this case, the reader remains in pc/sc mode as long as the card remains in the reader. whenever the emv mode fails, the smartcard is powered off. after the host application has sent the pc/sc switch (proprietary) escape command, the application must send a new card power on command. when the reader deals with an emv card, the data exchanged between the reader and the host consists of short apdu messages. when the card is not emv-compliant and the reader is set to pc/sc-iso mode, the reader exchanges tpdu messages with the host. restriction: character level and the extended apdu are not implemented in ST7GEME4 solution. table 3. technical features features description characteristics supported smartcards asynchronous ? microprocessor cards ? t=0, t=1 protocols ? transmission rate: 2 kbps to 344 kbps synchronous ? through a comprehensive api smartcard electrical interface smartcard power supply ? 5v/55ma and 3v/50ma and 1.8v/20ma ? short circuit current limitation ? power up/power down control sequences smartcard management ? card insertion/extraction detection esd protection on card i/o ? 4 kv human body model ST7GEME4 implementation ST7GEME4 12/28 drivers usb and serial versions ? microsoft windows 2000/xp/server 2003 ? microsoft windows ce 4.1/4.2/5.0 ? linux red hat/suse/debian ? microsoft windows xp 64-bit on amd64 and emt64 ? microsoft windows server 2003 64-bit ? mac os 10.3/10.4 compliance with class drivers ? microsoft windows 2000/xp/server 2003 ? microsoft windows vista (beta version) ? mac os 10.3/10.4 usb interface usb 2.0 compliant ? ccid v1.0 ? full speed, hubless ? bus powered, low consumption serial host interface serial asynchronous link ? transmission rate: 9.6 kbps to 115 kbps ? format: 8-bit, no parity ? auto baud rate communication protocol ? ccid v1.0 on serial ttl link other features temperature range ? operating range: 0 to +70c ? storage: -65 to +150c environmental standard ? rohs compliant table 3. technical features (continued) ST7GEME4 electrical characteristics 13/28 4 electrical characteristics 4.1 absolute maximum ratings the ST7GEME4 contains circuitry to protect th e inputs against damage due to high static voltages. however it is advisable to take normal precautions to avoid applying any voltage higher than the specified maximum rated voltages. for proper operation it is recommended that v i and v o be higher than v ss and lower than v dd . reliability is enhanced if un used inputs are c onnected to an approp riate logic voltage level (v dd or v ss ). power considerations the average chip-junction temperature, t j , in celsius can be obtained by the following equation: where: t a = ambient temperature rthja = package thermal resistance (junction-to ambient) p d = p int + p port p int = i dd x v dd (chip internal power) p port = port power dissipation determined by the user stresses above those listed as ?absolute ma ximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these conditions is not implied. exposure to maximum rating for extended periods may affect device reliability. warning: direct connection to v dd or v ss of the i/o pins could damage the device in case of program counter corruption (due to unwanted change of the i/o configuration). to guarantee safe conditions, this connection has to be done through a typical 10k ? pull-up or pull-down resistor. table 4. absolute maximum ratings symbol ratings value unit v dd - v ss supply voltage 6.0 v v in input voltage v ss - 0.3 to v dd + 0.3 v v out output voltage v ss - 0.3 to v dd + 0.3 v esd esd susceptibility 2000 v esdcard esd susceptibility for card pads 4000 v i vdd_i total current into v dd_i (source) 250 ma i vss_i total current out of v ss_i (sink) 250 t j t a pd rthja + = electrical characteristics ST7GEME4 14/28 4.2 recommended operating conditions operating conditions are given for t a = 0 to +70 c unless otherwise specified. table 5. thermal characteristics symbol ratings value unit r thja package thermal resistance vfqfpn24 42 c/w so24 80 c/w t jmax max. junction temperature 150 c t stg storage temperature range -65 to +150 c pd max power dissipation vfqfpn24 600 mw so24 500 mw table 6. general operating conditions symbol parameter conditions min typ max unit v dd supply voltage 4.0 5.5 v f osc external clock source 4 mhz t a ambient temperature range 0 70 c table 7. current injection on i/o port and control pins (1) 1. when several inputs are submitted to a current inject ion, the maximum injected current is the sum of the positive (resp. negative) cu rrents (instantaneous values). symbol parameter conditions min typ max unit i inj+ total positive injected current (2)(3) 2. positive injection. the i inj+ is done through protection diodes insula ted from the substrate of the die. 3. for smartcard i/os, v crdvcc has to be considered. v external >v dd (standard i/os) 20 ma v external >v crdvcc (smartcard i/os) i inj- total negative injected current (4)(5) 4. the negative injected current, i inj- , passes through protection diodes which are not insulated from the substrate of the die. the drawback is a small leakage (few a) induced inside the die when a negative injection is performed. this leakage is tolerated by the digital structure. the effect depends on the pin which is submitted to the injection. of course, exte rnal digital signals applied to the component must have a maximum impedance close to 50k ? . 5. location of the negative current injection: pure digital pins can tolerate 1.6ma. in addition, the best choice is to inject the current as far as possible from the analog input pins. v external ST7GEME4 electrical characteristics 17/28 figure 5. typical application with an external clock source table 13. external clock source symbol parameter conditions min typ max unit v oscinh oscin input pin high level voltage see figure 5 0.7v dd v dd v v oscinl oscin input pin low level voltage v ss 0.3v dd t w(oscinh) t w(oscinl) oscin high or low time (1) 1. data based on design simulation and/or technology characteristics, not tested in production. 15 ns t r(oscin) t f(oscin) oscin rise or fall time (1) 15 i l oscx input leakage current v ss v in v dd 1 a oscin oscout f osc external st7xxx clock source v oscinl v oscinh t r(oscin) t f(oscin) t w(oscinh) t w(oscinl) i l 90% 10% electrical characteristics ST7GEME4 18/28 4.4.2 crystal resonator oscillators the st7 internal clock is supp lied with one crystal resonator oscillator. all the information given in this paragraph are based on characterization results with specified typical external components. in the application, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output di stortion and start-up stabilization time. refer to the crystal resonator manufacturer for more details (frequency, package, accuracy...). table 14. crystal resonator oscillator characteristics symbol parameter conditions min typ max unit f osc oscillator frequency (1) mp: medium power oscillator 4 mhz r f feedback resistor 90 150 k ? c l1 c l2 recommended load capacitances versus equivalent serial resistance of the crystal resonator (r s ) see ta bl e 1 6 (mp oscillator) 22 56 pf i 2 oscout driving current v dd =5v, v in =v ss (mp oscillator) 1.5 3.5 ma 1. the oscillator selection can be optimized in terms of s upply current using an high qual ity resonator with small r s value. refer to crystal resonator manufacturer for more details. table 15. typical crystal resonator characteristics oscillator reference freq. characteristic (1) cl1 [pf] cl2 [pf] tsu(osc) [ms] (2) crystal mp jauch ss3-400-30- 30/30 4mhz ? f osc =[30ppm 25c ,30ppm ? ta ] , ty p. r s =60 ? 33 33 7~10 1. resonator characterist ics given by the crystal resonator manufacturer. 2. t su(osc) is the typical oscillator st art-up time measured between v dd =2.8 v and the fetch of the first instruction (with a quick v dd ramp-up from 0 to 5 v (<50 s). table 16. recommended values for 4 mhz crystal resonator symbol min typ max unit r smax (1) 20 25 70 ? c oscin 56 47 22 pf c oscout 56 47 22 1. r smax is the equivalent serial resistor of the crystal (see crys tal specification). ST7GEME4 electrical characteristics 19/28 figure 6. typical application with a crystal resonator 4.5 memory characteristics subject to general operating conditions for v dd , f osc , and t a unless otherwise specified. 4.6 smartcard supply supervisor electrical characteristics ta bl e 1 8 characteristics are measured at t a = 0 to +70 o c, 4.0 v < v dd - v ss < 5.5 v unless otherwise specified. oscout oscin f osc c l1 c l2 i 2 r f st7xxx resonator when resonator with integrated capacitors table 17. ram and hardware registers symbol parameter conditions min typ max unit v rm data retention mode (1) 1. minimum v dd supply voltage without losing data stored in ram (in halt mode or under reset) or in hardware register s (only in halt mode). not tested in production. halt mode (or reset) 2 v table 18. smartcard supply supervisor characteristics symbol parameter conditions min typ max unit 5 v regulator output (for iec 7816-3 class a cards) v crdvcc smartcard power supply voltage 4.6 5.00 5.4 v i sc smartcard supply current 55 ma i ovdet current overload detection 120 (1) ma t idet detection time on current overload 170 (1) 1400 (1) s t off v crdvcc turn-off time c loadmax 4.7f 750 s t on v crdvcc turn-on time c loadmax 4.7f 150 500 s v crdvcc v card above minimum supply voltage 4.52 (1) 4.76 (1) v i vdd v dd supply current (2) 100 ma electrical characteristics ST7GEME4 20/28 3 v regulator output (for iec 7816-3 class b cards) v crdvcc smartcard power supply voltage 2.7 3.3 v i sc smartcard supply current 50 ma i ovdet current overload detection 100 (1) ma t idet detection time on current overload 170 (1) 1400 (1) s t off v crdvcc turn-off time c loadmax 4.7f 750 s t on v crdvcc turn-on time c loadmax 4.7f 150 500 s 1.8v regulator output (for iec 7816-3 class c cards) v crdvcc smartcard power supply voltage 1.65 1.95 v i sc smartcard supply current 20 ma i ovdet current overload detection 100 (1) ma t idet detection time on current overload 170 (1) 1400 (1) s t off v crdvcc turn-off time c loadmax 4.7f 750 s t on v crdvcc turn-on time c loadmax 4.7f 150 500 s smartcard clkpin v ol output low level voltage i = -50 a - - 0.4 (3) v v oh output high level voltage i = 50 a v crdvcc -0.5 (3) --v t ohl output high to low fall time (1) c l = 30 pf - 20 ns t olh output low to high rise time (1) c l = 30 pf - 20 ns f var frequency variation (1) -1% f duty duty cycle (1) 45 55 % p ol signal low perturbation (1) -0.25 0.4 v p oh signal high perturbation (1) v crdvcc -0.5 v crdvcc +0.25 v i sgnd short-circuit to ground (1) 15 ma smartcard i/o pin v il input low level voltage - - 0.5 (3) v v ih input high level voltage 0.6v crdvcc (3) --v v ol output low level voltage i = -0.5 ma - - 0.4 (3) v v oh output high level voltage i = 20 a 0.8v crdvcc (3) -v crdvcc (3) v i l input leakage current (1) v ss electrical characteristics ST7GEME4 22/28 software recommendations the software flowchart must include the management of runaway conditions such as: corrupted program counter unexpected reset critical data corruption (control registers...) prequalification trials most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forci ng a low state on the reset pin or the oscillator pins for 1 second. to complete these trials, esd stress can be applied directly on the device, over the range of specification values. when unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note an1015). 4.7.2 electromagnetic interference (emi) based on a simple application running on the product (toggling 2 leds through the i/o ports), the product is monitored in terms of emi ssion. this emission test is in line with the norm sae j 1752/3 which sp ecifies the board and the loading of each pin. table 19. ems characteristics symbol parameter conditions level/ class v fesd voltage limits to be applied on any i/o pin to induce a functional disturbance v dd = 5v, t a = +25 c, f osc = 8mhz conforms to iec 1000-4-2 2b v fftb fast transient voltage burst limits to be applied through 100 pf on v dd and v dd pins to induce a functional disturbance v dd = 5v, t a = +25 c, f osc = 8mhz conforms to iec 1000-4-4 4b table 20. emi characteristics symbol parameter conditions monitored frequency band max vs. [f osc /f cpu ] (1) 1. data based on characterization results, not tested in production. unit 4/8mhz 4/4mhz s emi peak level v dd = 5v, t a = +25 c, conforming to sae j 1752/3 0.1 mhz to 30 mhz 19 18 db v 30 mhz to 130 mhz 32 27 130 mhz to 1ghz 31 26 sae emi level 4 3.5 - ST7GEME4 electrical characteristics 23/28 4.7.3 absolute maximum rati ngs (electrical sensitivity) based on three different tests (esd, lu and dlu) using specific measurement methods, the product is stressed in order to determine its per formance in terms of electrical sensitivity. for more details, refer to the application note an1181. electrostatic discharge (esd) electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. the sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). the human body model is simulated. this test conforms to the jesd22-a114a standard. static and dynamic latch-up lu : 3 complementary static tests are required on 10 parts to assess the latch-up performance. a supply overvoltage (applied to each power supply pin) and a current injection (applied to each input, output and configurable i/o pin) are performed on each sample. this test conforms to the eia/jesd 78 ic latch-up standard. for more details, refer to the application note an1181. dlu : electrostatic discharges (one positive then one negative test) are applied to each pin of 3 samples when the micro is running to assess the latch-up performance in dynamic mode. power supplies are set to the typical values, the oscillator is connected as near as possible to the pins of the mi cro and the component is put in reset mode. this test conforms to the iec1000-4-2 and saej1752/3 standards. for more details, refer to the application note an1181. table 21. absolute maximum ratings symbol ratings conditions maximum value (1) 1. data based on characterization results, not tested in production. unit v esd(hbm) electrostatic discharge voltage (human body model) t a = +25 c 2000 v table 22. electrical sensitivities symbol parameter conditions class (1) 1. class description: a class is an stmi croelectronics internal specification. all its limits are higher than the jedec specifications, that means when a device belongs to class a it exceeds the jedec standard. b class strictly covers all the jede c criteria (international standard). lu static latch-up class t a = +25 c a dlu dynamic latch-up class v dd = 5.5 v, f osc = 4mhz, t a = +25 c a electrical characteristics ST7GEME4 24/28 4.8 communication interface characteristics figure 7. usb data signal rise and fall time table 23. usb dc electrical characteristics (1) 1. rl is the load connected on the usb drivers. al l the voltages are measured from the local ground potential. parameter symbol conditions min. max. unit input levels differential input sensit ivity vdi i(d+, d-) 0.2 v differential common mode range vcm includes vdi range 0.8 2.5 v single ended receiver threshold vse 1.3 2.0 v output levels static output low vol rl of 1.5 k ? to 3.6 v 0.3 v static output high voh rl of 15 k ? to v ss 2.8 3.6 v usbvcc: voltage level usbv v dd =5 v 3.00 3.60 v table 24. usb full speed electrical characteristics parameter symbol conditions min max unit driver characteristics: rise time t r cl = 50 pf (1) 1. measured from 10% to 90% of the data signal. for mo re detailed informations, please refer to chapter 7 (electrical) of the usb sp ecification (version 1.1). 420ns fall time t f cl = 50 pf (1) 420ns rise/ fall time matching t rfm t r /t f 90 110 % output signal crossover voltage vcrs 1.3 2.0 v differential data lines v ss tf tr crossover points vcrs ST7GEME4 package characteristics 25/28 5 package characteristics 5.1 package mechanical data figure 8. 24-lead very thin fine pitch quad fl at no-lead 5x5 mm 0.65 mm pitch, package outline 1 6 7 12 13 18 19 24 d e b e2 e e l l b d2 a1 c a table 25. 24-lead very thin fine pitch quad flat no-lead 5x5mm,0.65mm pitch, mechanical data dim. mm inches (1) min typ max min typ max a 0.80 0.90 1.00 0.031 0.035 0.039 a1 0.02 0.05 0.001 0.002 b 0.25 0.30 0.35 0.010 0.012 0.014 d 5.00 0.197 d2 3.50 3.60 3.70 0.138 0.142 0.146 e 5.00 0.197 e2 3.50 3.60 3.70 0.138 0.142 0.146 e 0.65 0.026 l 0.35 0.45 0.55 0.014 0.018 0.022 ddd 0.08 0.003 number of pins n 24 1. values in inches are converted from mm and rounded to 3 decimal digits. package characteristics ST7GEME4 26/28 figure 9. 24-pin plastic small outline package- 300-mil width, package outline e 12 e d c h 13 28 1 b 9u_me a1 l a1 h x 45? a ddd table 26. 24-pin plastic small outline package- 300-mil width, mechanical data dim. mm inches min typ max min typ max a 2.35 2.65 0.093 0.104 a1 0.10 0.30 0.004 0.012 b 0.33 0.51 0.013 0.020 c 0.23 0.32 0.009 0.020 d 15.20 15.60 0.599 0.619 e 7.40 7.60 0.291 0.299 e 1.27 0.050 h 10.00 10.65 0.394 0.419 h 0.25 0.75 0.010 0.030 0 8 0 8 l 0.40 1.27 0.016 0.050 ddd 0.10 0.004 number of pins n 24 ST7GEME4 revision history 27/28 6 revision history table 27. document revision history date revision changes 01-aug-06 0.1 initial release 10-may-2007 1 root part number c hanged from st7gem to ST7GEME4. 21-sep-2007 2 document reformatted. modified figure 1 title. usb host interface replaced by usb interface in section 1: introduction and table 3: technical features . updated figure 9: 24-pin plastic small outline package- 300-mil width, package outline . ddd tolerance and maximum values in inched added in table 26: 24-pin plastic small outline package- 300-mil width, mechanical data . qfn24 package renamed vfqfpn24. figure 8: 24-lead very thin fine pitch quad flat no-lead 5x5 mm 0.65 mm pitch, package outline updated to remove a2 and a3 dimensions. ST7GEME4 28/28 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com |
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